Wuliang 06/08
Category： Wuliang series
Keywords:
Wuliang 06/08
Product Features
Providing solutions for IC substrates, wafers, and system packaging, and Glass Mask exposure processes
• Multi-chip interconnect packaging • Photolithography process, not limited by substrate morphology • Patent technology for multi-width chip splicing and interconnection exposureEmail：xjzm@synjoz.com
National Service Hotline：400-876-0066
Product Details
| Maximum substrate size | 610mm×630mm/630mm×730mm |
| Minimum resolution | 6μm/8μm |
| Alignment accuracy | ±5um/±6um |
| Maximum single-machine (wired) production capacity | 75 panels/hour/120 panels/hour |
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Service Hotline: 400-876-0066
Contact Us
Hangzhou Base：Nanyang Avenue, Nanyang Street, Xiaoshan District, Hangzhou City, Zhejiang Province
Zhongshan Base：No. 3-1, Mingzhu Road, Torch Development Zone, Zhongshan City, Guangdong Province
Huzhou Base：Tianheng Industrial Park, Xingye Road, Anji County, Huzhou City, Zhejiang Province
Email：xjz@synjoz.com
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