Project

AOI30

AOI25

Inspection Materials

Bare copper etched board: FR4, M4 M6 CEM-1, RTF, THE, VLP, Rogers

Flexible materials: Polyimide, Polyester, RCC laminated materials

Photoresist materials: Blue, Purple, Brown

Maximum substrate size

630mm*730mm

630mm*730mm

Minimum substrate size

300mm*300mm

300mm*300mm

Minimum line width and spacing

30μm

25μm

Detectable defects

Short circuit; Open circuit; Line width/spacing exceeding tolerance; Notch; Burr; Pinhole; Residual copper; Isolation ring copper protrusion, hole defects

Substrate thickness

0.05-5.0mm

0.05-5.0mm

Image acquisition system

High-resolution area array scanning imaging system

High-resolution area array scanning imaging system

Data format

ODB++, Gerber274X

ODB++, Gerber274X

Positioning method

Automatic full-board edge positioning/supports board surface 0°/90°/180°/270° (±5°), positive/reverse placement

Serial number identification

Inkjet printing serial number or laser laser engraving serial number (numbers and letters)

Defect approval

Repair station approval/online initial screening re-inspection/board serial number spray code marking